Flexible IO Expansion
DIME
The DIME is designed to expand the CEC Family with up to 2 additional Mini PCI Express sockets and SIM slots, as well as 4 additional USB 2.0 ports. Numerous different IO interfaces are supported with only one DIME adapter card (analog / digital / GPS / WiFi ....).The two mPCIe socket resides on their own PCIe link. So the maximum interface speed available from the host board is used.
Key Features
- Up to 2 half-/full-size card Mini PCI Express sockets
- All mPCIe sockets with USB2.0 support
- Each mPCIe slot has one Mini-SIM socket
- Up to four USB 2.0 ports
- Environment temperature -40°C up to +85°C
The DIME has been designed to withstand harsh environments and extreme temperature conditions. The special rugged design, combined with the best industrial-grade components, offer high reliability and long-term performance. If the application requires, the board can also be coated.
some integration samples:
![[mPCIe expansions (DIME)]](images/cec/dime-p2.jpg)
CEC solution with two mPCIe expansions
![[mPCIe expansions (DIME)]](images/cec/dime-p3.jpg)
MIL-CEC Solution with two mPCIe expansions
Technical Features
| Board Key Data | |
|---|---|
| mPCIe Socket | Full-Mini Card Size mini PCI Express socket, USB 2.0 support According to PCI Express Mini Card Electromechanical Specification Rev. 2.0 |
| Module (SIM) Slot | Directly accessible behind frontplate |
| USB 2.0 | 4 additional USB 2.0 ports on lockable header or USB 2.0 Type A |
| Power | |
| Power Dissipation | Depends on the plugged in mPCIe modules |
| Environment | |
| Storage Temperature | -45°C to 85°C (-49°F to 185°F) |
| Operating Temperature | -40°C to 85°C (-40°F to 185°F) |
| Relative Humidity | 5% to 95% none condensing |
| Standard Compliance | |
| The DIME is designed to meet or even exceed the most common standards. Particular references are: | |
| EMC | EN 55022, EN 55024, EN 61000, MIL-STD-461E |
| Shock & Vibration | EN 60068 |
| Environmental & Safety | EN 50155, MIL-STD-810-F, EN 60601, EN 60950 |
| Approval List | CE, IEC 60945, IACS E10 |
| Versions | |
|---|---|
| Reference | Description |
| DIME-20U | CEC10 Family Hex I/O Module Expansion 3 x mPCIe (incl. Back-1 and adjustment of the housing) |
| DIME-24U | CEC10 Family Hex I/O Module Expansion 2 x mPCIe, 4 x USB2.0 (incl. Back-1 and adjustment of the housing) |
Documentation
| Product | Description | Doc Type | Size | pdf File |
|---|---|---|---|---|
| DIME | DIME Datasheet | EN Datasheet | 481.92 KB | 
|
| DIME | DIME User Manual | EN Manual | 711.68 KB |
|
