Flexible IO node Expander (CHIME)

Flexible IO node Expander


The CHIME is designed to expand the CEC Family with up to 6 additional Mini PCI Express sockets. So many different IO interfaces can be supported with only one CHIME adapter card.

Each set of 3 mPCIe socket resides on its own PCIe link. So the maximum interface speed available from the host board is used

Key Features

The CHIME has been designed to withstand harsh environments and extreme temperature conditions. The special rugged design, combined with the best industrial-grade components, offer high reliability and long-term performance.

some integration samples:
[mPCIe expansions (CHIME)]

 CEC Solution with four mPCIe expansions

[mPCIe expansions (CHIME)]

 MIL-CEC Solution with five mPCIe expansions

Technical Features

Board Key Data
mPCIe Socket Full-Mini Card Size mini PCI Express socket, USB 2.0 support
According to PCI Express Mini Card Electromechanical Specification Rev. 2.0
Module (SIM) Slot Directly accessible behind frontplate
Power Dissipation Depends on the plugged in mPCIe modules
Storage Temperature -45°C to 85°C (-49°F to 185°F)
Operating Temperature -40°C to 85°C (-40°F to 185°F)
Relative Humidity 5% to 95% none condensing
Standard Compliance
The CHIME is designed to meet or even exceed the most common standards. Particular references are:
EMC EN 55022, EN 55024, EN 61000, MIL-STD-461E
Shock & Vibration EN 60068
Environmental & Safety EN 50155, MIL-STD-810-F, EN 60601, EN 60950
Approval List CE, IEC 60945, IACS E10

Reference Description
CHIME-3IS CEC10 Family hex I/O module expansion 3 x mPCIe, 1x SIM slot. (Back-1 must be ordered separately)
CHIME-62S CEC10 Family hex I/O module expansion 6 x mPCIe, 2x SIM slot. (Back-1 must be ordered separately)
CHIME-6ES CEC10 Family expansion with 6 mPCIe slots and two SIM holder, external power supply.
(Back-1 must be ordered separately)


Product Description Doc Type Size  pdf File
CHIME CHIME DatasheetEN Datasheet692.51 KBdownload
CHIME CHIME User ManualEN Manual935.3 KBdownload
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