CEC Options

 pdf
Although the MPL Processor boards are traditionally equipped quite well, special interfaces like sound or standard PCI slots are sometimes required in industrial applications. Therefore, we provide you with a selection of optional expansion modules to further extend the capabilities of the MPL processor boards.

CEC Options Matrix

Product / Function CEC10 Family CEC7* CEC4* Comments
BOLERO
UPS System for embedded computer 0°C to +60°C
UPS integrated 0°C to 60°C question		       external
BOLERO
UPS System for embedded computer, extended temperature -40°C to +75°C
UPS integrated -40 to 75°C question		       external
PIPCAN
CAN module for PIP platform (PIP30 with miniPCIe module)
CAN module question		       mini PCIe
PIPLD-1
Reverse voltage and load dump protection module for PIPs (not required for PIP30)
Reverse voltage protectionquestion		       on-board
REDPI-1
providing redundant power input concept
redundant power input question		       version REDPI-1
SePS
GPS module for PIPs (PIP30 via miniPCIe module)
GPS module question		       mini PCIe
SERIF-1 / SERIF-31
Additional RS232 interface for the PIP, maximum 2 modules
RS232 module question		       version SERIF-1ISO
SERIF-2 / SERIF-32
Additional RS422/485 interface for the PIP, maximum 2 modules
Isolated RS422/485 module question		       version SERIF-2ISO
HDSound
High definition sound module
Sound module question		        
WLAN-USB
Additional WLAN module for PIPs
Rugged WLAN module question		       mini PCIe
CHIME
Flexible IO node expander, up to 6 additional slots with SIM
CHIME mPCIe expansion question		       up to 6 additional slots with SIM
DIME
Flexible IO expansion, up to 2 additional slots with SIM / up to 4 USB 2.0
DIME mPCIe expansion question		       up to 2 additional slots with SIM
USBBACK-6   6 x USB 2.0 on headers or serial ports (RS232/422/485)
USM-1             Additional 4x USB and 3x RS232
4SER-mPCIe-1   4x serial ports RS232,/RS422 /RS485 via mPCIe module
8SER-mPCIe-1   8x serial ports RS232/RS422/RS485 via mPCIe module
USB/Serial Module question		        
CECDVI-D   DVI Graphic Interface
CECDVI-DL   DVI Graphic Interface on lockable header
CECVGA-1   VGA Graphic Interface
DP2LVDS-1   LVDS Graphic Interface
DUALDP-1   DP Graphic Interface
2nd Graphic Interface question		       DVI, VGA, LVDS, or DP
CEC1xTPM1.2
TPM (Trusted Platform Module) option with TPM1.2
Trusted Platform Module question		        
EN 50155 Railway certified       Class TX
IEC 60945 Maritime certified in preparation      

* for new designs, use CEC10 Family


CEC Housing options Footprint Height Characteristics
DIN-Rail 62.0 x 120.0 mm 162.1 mm rugged chromated aluminum with stainless steel plates
Flange 62.0 x 123.0 mm 198.05 mm rugged chromated aluminum with stainless steel plates
Open Frame min. 102 x 153 mm min. 23 mm mounted on cooling plate with passive cooling concept
MIL / Outdoor 175 x 182 mm min. 66 mm for harshest environment up to IP67 protected
 Copyright © 1997-2019 MPL AG Elektronikunternehmen, a member of the HT Holding AG  |  Privacy Statement
MPL on LinkedIn    MPL on twitter    MPL on Google+